Någon elektronik i pipe-line? Som underleverantör, legotillverkare, kontraktstillverkare lämnar vi gärna priser för ytmontering av kretskort och SMD. Vi utför din produktion / legotillverkning.

 Till startsidan om ytmontering och ytmonterade komponenter på kretskort. Inge Eklund Elektronik. Vi finns i Sundsvallregionen.

 Produktion och automatisk montering av ytmonderade komponenter i små och mindre serier. Så här producerar vi med SMD. Legotillverkning och kontraktstillverkning.

 Vår specialitet är ytmontering i små, mindre och medelstora serier om 5 till 500 st per leverans. Legotillverkning och kontraktstillverkning inom ytmontering.

 Vi anser oss hålla en mycket hög kvalitet inom ytmontering. Läs mer om hur vi når den.

 Hos oss är du välkommen som kund att ytmontera i små och mindre serier. Vi behandlar dig personligt.

 Prissättning / priser för ytmontering. Legoproduktion i små, mindre och medelstora serier till förmånliga priser. Legotillverkning / kontraktstillverkning av kortmontering.

 Om ytmontering, ytmonterade kort, SMD, SMT, kretskort, elektronikmontering och hur vi sätter samman elektronikkomponenter till moduler. Detta beskriver vårt sätt att arbeta. Vi gör även hålmontering där så behövs.

 Kontakta oss gärna om ytterligare info om att ytmontera, ytmontering, legotillverkning, produktion, CAD, kontraktstillverkning osv. Vi finns i Sundsvallsområdet närmare bestämt Timrå. Vi legotillverkar gärna dina ytmonterade kort.
Kretskort och produktion ordbok för förkortningar inom elektronik, komponenter och produktion av kretskort.

 Vi erbjuder utvecklingshjälp och konsultation vid såväl utvecklingan av elektronik, ingående programvaror eller verktug runt detta samt hjälp vid produktionsanpassning i såväl små som stora serier.

Ytmontering av kretskort

Vi arbetar med elektronik, elektronikmontering och produktion av kretskort. I första hand är det ytmonterade kretskort som är vårt arbetsområde men det blir även betydande antal kort med hålmontering samt full lego.


Det som är speciellt med oss är att vi utför automatisk montering i små och mindre serier av kretskort. Man är således välkommen till oss med serier om 25 eller 300 st. Vi har anpassat verksamheten för mellan 5 och 1000 st kretskort per omgång i produktion. Rena prototyper gör vi också men då inte helautomatisk montering.


Här nedan är en liten ordlista med förkortningar inom elektronik, produktion och elektronikmontering / elektronikmontage och som kan vara bra att ha till hands. Välkommen till www.ytmontera.com oavsett om det enbart gäller att titta i ordboken, fråga oss om ett pris eller anlita oss för elektronikmontering, CAD, lego eller konsultation. 



ACI - Automatic Component Insertion - komponenter och montering i produktion


ANSI - American National Standards Institute - standardisering


AOI - Automated Optical Inspection. Test fixture method in which printed circuit boards

are checked at bare-board, pre-or post-soldered stages of assembly by optical

means.  - automatisk optisk test av kretskort inför och i produktion / tillverkning .


ASIC - Application Specific Integrated Circuit - kretsar


ASM - American Society of Metals - normer


ASTE - American Society Test Engineers - test


ASTM - American Society for Testing and Materials - test


ASQC - American Society Quality Control - kvalitet och kontroll


ATE - Automatic Test Equipment. Equipment designed to automatically analyze

functional or static parameters in order to evaluate performance degradation. It

may also be designed to perform fault isolation.  - test i produktion av kretskort


ATG - Automatic Test Generation. Computer generation of a test program based solely

on the circuit technology, requiring little or no manual programming ef fort.  - test av kretsar och kretskort i produktion


BGA - Ball Grid Array. A component whose terminations are on the bottom of the

package, and are in the shape of solder balls and in a grid array pattern. This

generally covers components that have them in a full array or in a partial array

with “missing” balls in the center.  - komponenter


CAD - Computer Aided Design. A computer based system to assist designers in the

design, topological layout and drawing of an electronic component, assembly, or

system.  - rita upp mönsterkort


CBGA/CCGA - Ceramic Ball Grid Array/Ceramic Column Grid Array. A grid array packaged

component that has ceramic as the substrate of the package, and may have

either solder balls or solder columns for connections.  - komponenter


CFC - Chlorinated Fluorocarbon.


CMA - Circuit Mil Area. A unit of area equal to the area of a circle whose diameter is

one mil (0.001”). Used chiefly in specifying cross-sectional areas of conductors.  - måttenhet mönsterkort


CMOS - Complementary Metal Oxide Semiconductor - komponent för kretskort


CMT - Chip Mount Technology. Any packaging or electronic assembly manufacturing

technology, such as TOB, COB, or flip chip, that connects bare (unpackaged) IC

chips to the substrate.  - montering av oskyddade komponenter


COB - Chip-on-Board. A situation where the silicon IC chip is mounted directly to the electronic assembly substrate or PWB without an intermediate packaging step.

Connections between the chip and the board are generally made with lbond wired

(also sometime called ‘chip and wire’), but the terminology is occasionally used for

any chip connection technique such as flip chip (solderable bumps or tape

automated bonding.  - montering och produktion kretskort


CSP - Chip Scale Package. Active, multi-I/O package that is no larger than 125% of the

size of thesilicon IC.  - produktion


CTE - Coefficient of Thermal Expansion. See TCE


DFM - Design for Manufacturability


DFT - Design for Test


DIL - Dual In-Line. Component shape with two parallel rows of connection leads.  - kapsling av kretsar för produktion


DIP - Dual In-Line Package. A popular through hole package with leads in rows on

opposite sides of the package.  - kapsling av kretsar för produktion


DRAM - Dynamic RAM. Read-write memory that must be refreshed (read or written into)

periodically to maintain the storage of information.  - minnestyp


DUT - Device Under Test. Component, PCB, or assembly subjected to a test. Also

known as unit under test (UUT) and loaded board.  - test i kretskort och produktion


EIAJ - Electronic Industries Association in Japan


ESD - Electrostatic Discharge. A transfer of electrostatic charge between bodies at different electrostatic potentials caused by direct contactor induced by an

electrostatic field.  - elektrostatisk urladdning


ESS - Environmental Stress Screening. Manufacturing stage in which all assemblies

are subjected to abnormal stresses, with the aim of forcing all early failures to

occur. Also known as reliability testing.  - stresstest och test av pålitlighet


FCA - Flip Chip Attach. The technique of attachment of an IC chip to a substrate using

solderable bumps between the silicon chip and substrate.  - kretsteknik


FPT - Fine Pitch Technology. The portion of surface mount technology that included

components that typically have lead pitch, or center-to-center spacing, between

0.4mm and 0.8mm.  - montering kretskort / ytmontering


FP - Flat Pack. Allow profile IC package, which typically has gull wing type of leads

on two or four sides.  - typ av kapsling kretsar


FR-4 - The most commonly used epoxy-fiberglass material standard for printed circuit boards. The “FR” refers to flame retardant.  - PCB / kretskort bas


HASL - Hot Air Soldered Leveled. Hot air is used to blow of the excess after the PWB is dipped in solder. Typically used with the SMOBC process.  - montering komponenter kretskort hetluft


IC - Integrated Circuit. A small, complete circuit made by vacuum deposition and

other techniques, usually on a silicon chip, and mounted in a package.  - integrerad krets


IEEE - Institute of Electrical and Electronics Engineers - standard


ILB - Inner Lead Bonding. Process of bonding termination, which leads to a tape

automated bond integrated circuit’s bumps.  - processteknik


IMAPS - International Microelectronics and Packaging Society.


IMC - Intermetallic Compound. Metallic compounds that form at the interfaces between

different metals, such as copper-tin compounds that form at the interface of a

solder joint and a copper lead. IMCs typically have significantly different

properties, such as tensile strength.  - sammanbyggnad produktion


IPC - Institute for Interconnecting and Packaging Electronic Circuits


IR - Infrared. Soldering process that uses infrared energy as the primary method of

heating.  - infraröd lödning i produktion av kretskort


ISO - International Standards Organization.  - standard


JEDEC - Joint Electronic Devices Engineering Council, apart of the Electronic Industries Association (EIA) that publishes specifications and standards for electronic components.  - specifikationer och standarder


KGB - Known Good Board. A correctly operating PCB. It is used in learning or

debugging a test program in development and for comparison testers where it

serves as the standard unit by which other PCBs are compared.  - referenskort vid test i produktion


KGD - Known Good Die - se KGB


LCCC - Leadless Ceramic Chip Carrier (or CLCC for Ceramic Leadless Chip Carrier). A

hermetically sealed ceramic package that has pads (castellations) around its

sides for solder connection in a surface mounting application.  - typ av kapsling för ytmontering


LDCC - Leaded Ceramic Chip Carrier. A hermetically sealed ceramic package that has

leads around its sided for solder connection in a surface mounting application.

Typically, thee packages have over 28 leads.  - typ av kapsling för ytmontering


LSI - Large Scale Integration. Arrays of ICs on a single substrate that comprise 100 or more individual active circuit functions or gates.  - benämning packning av komponenter


MCM - Multichip Module. A circuit comprised of two or more silicon devices bonded

directly to a substrate by wire bond, TAB, of flip chip.  - modul med flera kretsar


MELF - Metal Electrode Face Bonding. A cylindrical leadless component with a round

body and metals terminals on the ends.  - benämning kapsling för ytmontering, t.ex dioder


MLB - Multi Layer Board. A PWB that has more than two conductor layers. The layers

are interconnected by the plated-through holes.  - kort med flera lager för ledningsdragning


MSD - Moisture Sensitive Device.


MTBF - Mean Time Between Failures. The arithmetic or statistical mean average time

interval, usually in hours, that may be expected between failures of an operating

unit. Results should be designated actual, predicted, or calculated.  - beräkningsgrund för medeltid mellan felintervall


MTTF - Mean Time To Failure. Average time between failures.  - beräkningsgrund för medeltid till fel


MTTR - Mean Time to Repair. A measure of how long it takes to access a failed system and identify, locate, and repair the fault.  - beräkningsgrund för medeltid att lokalisera och reparera fel


OSP - Organic Solder Preservative. Layers of organic coatings applied to entire boar surfaces to prevent oxidation and to retain solderability.  - monteringsteknik


PBGA - Plastic Ball Grid Array. A ball grid array component whose package substrate is

made of plastic, most likely an FR-4 equivalent of epoxy-fiberglass, polyimide-

arramid, or similar resin-fiber combinations.  - kapsling


PCA - Printed Circuit Assembly. The generic term for a PCB after all electrical

components have been attached. Also referred to as a printed wiring assembly

(PWA).  - färdigmonterat kretskort


PCB - Printed Circuit Board. A part manufactured from a rigid base material upon

which a completely processed printed circuit has been formed.  - kretskort / mönsterkort ( "tryckt ledningsdragning" )


PGA - Pad Grid Array. Similar to a pin grid array. An IC package that has solderable

connections in a grid layout on the bottom of the package, and is soldered to the

surface of the substrate (PWB) with but solder joints.  - kapsling


PCMCIA - Personal Computer Memory Card International Association. The organization

that has developed the early standards for the various sizes of modules which

were initially for memory expansion but are now used for many different

electronic functions.  - känd för standard av t.ex. minneskorts, även kallat PCCARD .


PLCC - Plastic Leaded Chip Carrier. A plastic IC package for surface mounting

Applications that has leads, generally “J” leads, on al fours sides (sometimes

given as PCC or PLDCC).  - kapsling komponent


PPM - Parts Per Million


PQFP - Plastic Quad Flat Pack. An FP with leads on fours sides. Generally refers to a plastic quad flat package that is built to JEDC standards.  - kapsling komponent


PTH - Plated Through Hole. An interconnection from one side of a PWB (PCB) to

another that is formed with the copper plating of the via (hole) sidewalls.  - anslutningar mellan ena kretslagret till andra på ett kretskort


PWA - Printed Wiring Assembly. The generic term for a PWB after all electrical

components have been attached.  - monterat mönsterkort / kretskort


PWB - Printed Wiring Board. The substrate, generally epoxy glass, used to provide

component attachment lands and interconnections to form a functioning

electronic circuit (also called a PCB or printed circuit board).  - mönsterkort / kretskort


QFP - Quad Flat Pack. A FP with leads on four sides. Generally refers to a plastic

quad flat package that is built to EIJ standards.  - kapsling komponent


QPL - Qualified Products List. A listing of manufacturers qualified by test and

performance verification to produce items listed in the MIL specs.  - lista av kvalificerade tillverkare för MIL (militärspecificerade)


QSOP - Quarter-Size Smal Outline Package. An SO style IC package that has leads on

a 25 mil pitch. The name derives from the fact that the package is approximately

½ the length and ½ the width of a standard SOIC, and thus a package of the

same pin count occupies approximately ¼ the area on a PWB.  - kapsling komponent


RAM - Random Access Memory. A type of memory that offers access to storage

locations within it by means of X and Y coordinates.  - typ av minne och hantering av minnesposition


RCC - Rectangular Chip Carrier. A chip carrier with unequal length and width

dimensions.  - kapsling


ROM - Read Only Memory. A random access storage in which the data pattern is

unchangeable after manufacture.  - förprogrammerat minne för enbart läsning


SCC - A chip carrier with a square body.  - kapsling


SIP - Single-In-Line Package. An IC package or multi-component sub-assembly that

has connections or leads in a single row on one side.  - kapsling komponent


SIR - Surface Insulation Resistance


SMA - Surface Mount Assembly. An electronic assembly or module that is

manufactured with surface mounted components and suing surface mount

technology.  - ytmontering


SME - Society of Manufacturing Engineers


SMTA - Surface Mount Technology Association


SMC - Surface mount components. Any electrical or mechanical component that can be attached to the surface of a substrate with solder.  - ytmonterade komponenter


SMD - Surface Mount Device.  - ytmonterad enhet


SMOBC - Solder Mask Over Bare Copper. A printed wiring board manufacturing technique whereby solder mask is applied over bare copper, exposed and developed, and then the board is dipped in molten solder to coat the exposed copper.  - teknik för att förbereda kretskort för montering av komponenter


SMT - Surface Mount Technology. The technology used to manufacture electronic

assemblies using components that are soldered directly to the surface of the

substrate or PWB.  - teknik för ytmontering av kretskort


SO - Small Outline. A package resembling a flat pack with leads on only two sides.  - kapsling komponent


SOIC - Small Outline Integrated Circuit. A plastic IC package for surface mounting

Applications that has leads on two opposite sides.  - kapsling komponent


SOJ - A plastic IC package with “J” leads on two sides. It resembles a plastic DIP or an SOIC except for lead spacing and forming.  - kapsling component


SOL/SOW - Small Outline-Large/Small Outline Wide. SO generally refers to a package that

is approximately 150 mils wide, while SOL/SOW refers to packages that are

approximately 300mils wide.  - kapsling komponent (2 olika bredder)


SOP - VSOP/SSOP. Another designation for the small outline ICP packages, i.e. Small

Outline Package (Very Small Outline Package, Shrink Small Outline Package) - kapsling komponent


SOT - Small Outline Transistor. A plastic leaded package for diodes and transistors

used in surface mounting applications.  - kapsling komponent


SPC - Statistical Process Control. The use of statistical techniques to analyze a

processor its output to determine any variation from a benchmark and to take

appropriate action to restore statistical control, if required.  - statistisk analys


SSOIC - Shrink Small Outline IC. An SO style IC package that has leads on a 25 mil

pitch.  - kapsling komponent


TAB - Tape Automated Bonding. An IC interconnection process that uses organic tape

to support pre-formed leads during bonding to the chip (inner lead bonding-ILB)

and connection to the substrate (outer lead bonding-OLB). The IC chip is usually

bare during the interconnecting processes.  - monteringsteknik kretsar


TBGA  - Tape Ball Grid Array. A ball grid array component package that uses TAB

techniques to make the connections between the IC chip and the solder bals.

This results in a solder ball grid array that is only around the periphery, and

leaves compliant connections between the IC and the solder balls for better TCE

reliability.  - monteringsteknik kretsar


TCE (CTE) - Thermal Coefficient of Expansion (Coefficient of Thermal Expansion). The rate of expansion (ppm/C) of a material when its temperature is increased.  - variation beroende på temperatur


VFP  - Very Fine Pitch. The center-to-center lead distance of surface mount packages that are between 0.012 inch and 0.020 inch.  - benämning inom ytmontering


VLSI  - Very Large Scale Integration


VSP  - Vapor Phase Soldering. Soldering accomplished by using heat generated by the

condensing of a vapor ion a cooler assembly. VSP is achieved with SMT by

using a high temperature, approximately 215 degrees C, special prefluorinated

fluid.  - lödmetod


VSOIC - Very Small Outline IC. An SO style IC package that has leads with a pitch of 30 mils or less.  - kapsling komponenter


WOM - Write Only Memory. A non access storage. Not a real component but used as a joke.  - teknikhumor


0402 - benämning storlek för ytmontering på kretskort vid layout och produktion


0603 - benämning storlek för ytmontering på kretskort vid layout och produktion


0604 - benämning storlek för ytmontering på kretskort vid layout och produktion


0805 - benämning storlek för ytmontering på kretskort vid layout och produktion


1005 - benämning storlek för ytmontering på kretskort vid layout och produktion


1205 - benämning storlek för ytmontering, t.ex motstånd - kapsling komponent ( det finns ett antal olika sifferbenämningar beroende på komponentens storlek )

Automatisk montering av SMD komponenter i små och mindre serier. Elektronikmontering.

Lego, elektronikmontering, kontraktstillverkning, elektronik, produktion, flexibilitet, prisvärt, prototyper och nollserier.